chipsilo.com

Finding the right components shouldn’t be so complicated

We source hard-to-find electronic components and technology hardware for businesses that consistently need the highest quality products.

Simply your work.

Problem Solving

Zeebaware was born to help solve end-users’ biggest obsolescence challenges in distribution and DMSMS interrupters and deliver top notch results that work for you.

Transparency

We pride ourselves on transparency as we source and deliver top quality and hard-to-find electronic components and technology products.

Big Distribution in a Small Package

At Chipsilo, you get big distribution from a small business who is dedicated to solving big problems.

With quickly moving technology legacy original parts become more difficult to source

As a result, substandard parts flood the market.

We help take the pain out of the process by providing a team with years of industry knowledge and combine that with rigorous purchasing standards and a demand for exceptional quality so you know you’re getting the best products.

Whatever your challenge, we’ll help to find options that fit your needs.

Our story and purpose

“Chipsilo”, the Silo of chip for your manufature and business.

Simply your working — from quality facilities, detailed inspection processes to creative sourcing solutions and open and honest communication.

With the increasing complexities in the supply chain as well as a growing shortage of knowledgeable experts in sourcing hard-to-find and obsolete products, Chipsilo’s purpose is to deliver smooth and useful results that work for you.

As a small business, our focus is always on you. Whatever your challenge is, we strive to find solutions that solve your challenges.

You’ll get the support you deserve from a team of experts with exceptional industry knowledge, transparency, and zest. Simply put, Chipsilo delivers big distribution in a small package.

Get the products and services you need done right

We’ll leverage our qualified network of trusted suppliers to find what you need.

Shortage Mitigation

Our vigilant sourcing team has the experience and proven expertise to effectively source from Chipsilo’s global network of qualified vendors in addition to our established relationships with OCMs, OEMs, and EMS providers.

Excess Purchasing Solutions

Chipsilo ware offers inventory evaluation of excess electronic components and finished goods. Results of our evaluation may include inventory management programs for underutilized assets, offers for outright purchases, lot offers and more.

Inventory Management Programs

For safe storage and management of of your EOL (end of life ) and obsolete items & distribution to partners.

Cost Reduction Services

Our cost savings plans are a direct benefit realized from actions that help to reduce the organization from overspending.

INSPECTION BEFORE SHIPMENT

Chipsilo helps secure the electronics industry supply chain with rigorous testing procedures, stringent quality standards and meaningful reporting.

Surface Inspection:

Outer Packaging Inspection
Label Inspection
Body Marking Inspection
Oxidation Inspection
Overall Inspection and Sampling

Solderability Test

Prevent assembly problems and storage difficulties.

The solderability of your components determines potential IC or PCB failures and the overall quality of your product. Solderability tests are used to determine the wettability of the connections and their connectivity. They also provide information about their heat resistance and shelf life.

Solderability test approach follows the IPC standard for solderability testing to ensure accurate test results. Components under test undergo a comprehensive process from preconditioning to actual testing, evaluation and reporting. The entire control process is based on the AS6081 protocol and the J-STD-002D standard.

X-ray Analysis

X-ray analysis is a useful, non-destructive process that allows us to examine a component’s interior structure, including any wire bonding, foreign material, unusual voids, or other possible abnormalities. The interior is also compared to and tested among others from the same batch to ensure uniformity and structural integrity.

Decapsulation

Decapsulation can be done either mechanically or chemically in order to expose the interior portion of a device. Our lab technicians then inspect the interior and verify the die markings and part numbers as well as die position, orientation, and size.

Moisture Baking Testing

Using a low-heat oven, moisture-sensitive devices are properly baked according to industry standards to remove any moisture. After baking, the components are dry packed to ensure durability and moisture sensitivity levels.

XRF Testing

X-ray fluorescence testing is used to evaluate the elemental composition of lead materials. This is helpful in not only determining the authenticity of lead materials but also screening for any signs of hazardous materials and heavy metals (RoHS).

Packaging & Shipment

Poorly handled and packaged electronics lead to damaged leads and assemblies, oxidation that results in solderability problems, ESD damage, and even moisture intrusion which can result in delamination and popcorning.

Our objective is to deliver your product to the manufacturing location ready-to-use with appropriate ESD and MSL safe packaging, compliant with EIA- 481 component packaging standard.

Tape and Reel
Solderability Testing Transfer Carriers
External Visual Inspection Baking
Re-boxing Dry-pack
Custom Labeling

Support global drop-shipping

Chipsilo Team

Bianca Gosh
CEO
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Linus Slim
CFO
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Ilaria Cue
CMO
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Brian Masset
CTO
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